surmount tm pin diode rev. v3 ma4sps552 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? surface mount device ? no wirebonds required ? rugged silicon - glass construction ? silicon nitride passivation ? polymer scratch protection ? ultra - low parasitic capacitance and inductance ? higher power handling (efficient heat sinking) ? rohs* compliant description the ma4sps552 is a silicon - glass pin diode chip fabricated with macoms patented hmic process. this device features two silicon pedestals embedded in a low loss glass. the diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. selective backside metallization is applied producing a surface mount device. the topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. these protective coatings prevent damage to the junction and the anode air - bridge during handling and assembly. these packageless devices are suitable for usage in moderate incident power (5 w cw) or higher incident peak power (200 w, 1 s, 0.001 duty) series, shunt, or series - shunt switches. small parasitic inductance, 0.7 nh, and excellent rc constant (0.20 ps) make the devices ideal for tr switch and accessory switch circuits, where higher p1db and ip3 values are required. these diodes can also be used in , t, tapered resistance, and switched - pad attenuator control circuits for 50 or 75 systems. ordering information 1 part number package ma4sps552 100 pc. die in carrier madp - 000552 - 12810t 3000 pc. pocket tape on reel package dimensions 2 inches mm dim min max min max a 0.0207 0.0226 0.525 0.575 b 0.0108 0.0128 0.275 0.325 c 0.0040 0.0080 0.102 0.203 d 0.0075 0.0095 0.190 0.241 e 0.0032 0.004 0.081 0.101 f 0.0061 0.0081 0.155 0.205 g 0.0069 0.0089 0.175 0.225 2. backside metal: 0.1 m thick. * restrictions on hazardous substances, european union directive 2011/65/eu. 1. reference application note m513 for reel size information. a b c g d e f
surmount tm pin diode rev. v3 ma4sps552 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 absolute maximum ratings 3,4 parameter absolute maximum dissipated rf & dc power 1 w forward current 100 ma reverse voltage - 200 v operating temperature - 65c to +150c storage temperature - 65c to +150c junction temperature +175c mounting temperature +260c 3. exceeding any one or combination of these limits may cause permanent damage to this device. 4. macom does not recommend sustained operation near these survivability limits. electrical specifications @ +25c symbol parameter conditions units min. typ. max. c t capacitance - 40 v, 1 mhz - 40 v, 1 ghz pf 0.08 0.06 0.14 r s resistance 100 ma, 100 mhz 20 ma, 100 mhz 1.7 2.4 v f forward voltage 100 ma 10 ma v 1.00 0.88 1.25 1.00 v r reverse voltage - 10 a v | - 200 | | - 275 | i r reverse leakage current - 40 v na | - 10 | r ? jc thermal resistance steady state c/w 30 t l lifetime +10 ma / - 6 ma ( 50% - 90% v ) s 2.5 handling procedures please observe the following precautions to avoid damage: static sensitivity these electronic devices are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices.
surmount tm pin diode rev. v3 ma4sps552 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical performance curves series resistance vs. frequency capacitance vs. frequency series resistance vs. reverse bias capacitance vs. voltage series resistance vs. current 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.0 0.2 0.4 0.6 0.8 1.0 0 v -5 v -40 v ct (pf) frequency (ghz) 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0 10 20 30 40 100 mhz 1 ghz ct (pf) voltage (v) 0.0 1.0 2.0 3.0 4.0 0.0 0.1 0.2 0.3 0.4 0.6 0.7 0.8 0.9 1.0 10 ma 20 ma 50 ma 100 ma r s (ohm) frequency (ghz) 1.0 10.0 100.0 0.01 0.1 1 10 100 100 mhz 1 ghz r s (ohm) current (ma) 1,000 10,000 100,000 1,000,000 -40 -30 -20 -10 0 100 mhz 1 ghz r p (ohm) reverse bias (-v)
surmount tm pin diode rev. v3 ma4sps552 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 typical performance curves input return loss vs. frequency insertion loss vs. frequency isolation vs. frequency output return loss vs. frequency -40 -30 -20 -10 0 1 2 3 4 5 6 s11 (db) frequency (ghz) -40 -30 -20 -10 0 1 2 3 4 5 6 s22 (db) frequency (ghz) -0.8 -0.6 -0.4 -0.2 0.0 0 1 2 3 4 5 6 s21 (db) frequency (ghz) -40 -30 -20 -10 0 0 1 2 3 4 5 6 s21 (db) frequency (ghz)
surmount tm pin diode rev. v3 ma4sps552 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 handling all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. bulk handling should insure that abrasion and mechanical shock are minimized. die attach attachment to a circuit board is made simple through the use of surface mount technology. mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. these devices are well suited for solder attachment onto hard and soft substrates. the use of 80au/20sn and 60sn/40pb solder is recommended. conductive epoxy for attachment may also be used. when soldering these devices to a hard substrate, hot gas die bonding is preferred. we re - commend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. when soldering to soft substrates, it is recommended to use a lead - tin interface at the circuit board mounting pads. position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. equal heat must be applied to both ohmic contacts. since the hmic glass is transpar- ent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. recommended temperature and re - flow profiles for 60/40, sn/pb and rohs compliant solders are provided in application note m538 , surface mounting instructions.
surmount tm pin diode rev. v3 ma4sps552 6 6 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 6 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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